{"id":4067,"date":"2026-03-13T22:35:25","date_gmt":"2026-03-13T13:35:25","guid":{"rendered":"https:\/\/oesolutions.com\/ko\/?p=4067"},"modified":"2026-03-13T22:35:25","modified_gmt":"2026-03-13T13:35:25","slug":"oe-solutions-announces-23dbm-ultra-high-power-cooled-elsfp-sampling-begins-q3-2026","status":"publish","type":"post","link":"https:\/\/oesolutions.com\/ko\/oe-solutions-announces-23dbm-ultra-high-power-cooled-elsfp-sampling-begins-q3-2026\/","title":{"rendered":"OE Solutions Announces 23dBm Ultra-High Power Cooled ELSFP; Sampling Begins Q3 2026"},"content":{"rendered":"<p style=\"font-weight: 400;\"><strong>Gwangju, South Korea and Ridgefield Park, N.J. \u2013 March 13, 2026<\/strong><\/p>\n<p style=\"font-weight: 400;\">OE Solutions, a global leader in optical innovation, today launched its\u00a0<strong>Ultra-High Power (UHP) Cooled ELSFP<\/strong>\u00a0(External Laser Small Form-Factor Pluggable) module. Delivering\u00a0<strong>23dBm (200mW)<\/strong>\u00a0of optical power per channel, this module provides the high-intensity light source required to drive Co-Packaged Optics (CPO) in next-generation AI environments.<\/p>\n<p style=\"font-weight: 400;\">By utilizing an external pluggable format, the UHP ELSFP moves the laser source to the switch faceplate. This strategic design decouples heat-sensitive laser components from the high-temperature environment of the switch ASIC, significantly enhancing overall system reliability and thermal efficiency.<\/p>\n<p style=\"font-weight: 400;\"><strong>Technical Specifications &amp; Availability<\/strong><\/p>\n<ul style=\"font-weight: 400;\">\n<li><strong>Ultra-High-Power Performance:<\/strong>\u00a0Delivers 23dBm of stable O-band output.<\/li>\n<li><strong>Integrated Precision Cooling:<\/strong>\u00a0Features internal Thermoelectric Cooler (TEC) to maintain wavelength stability and extend laser lifespan under extreme power densities.<\/li>\n<li><strong>Scalable Configurations:<\/strong>\u00a0Available in 8-channel versions to support a wide range of switch architectures.<\/li>\n<li><strong>2H 2026 Sampling:<\/strong>\u00a0Samples of the 23dBm Cooled ELSFP will be available to customers starting in the\u00a0<strong>third quarter of 2026<\/strong>.<\/li>\n<\/ul>\n<p style=\"font-weight: 400;\">\u201cReaching the 23dBm threshold in a cooled, pluggable module is a critical milestone for 1.6T scaling,\u201d said\u00a0<strong>Dr. Walter Lee<\/strong>, Executive VP and Global CMO at OE Solutions. \u201cBy providing a high-power, thermally stable light source, we are removing the primary roadblocks to next-generation AI networking. We look forward to shipping samples in Q3 2026 to accelerate the global transition to 1.6T infrastructure.\u201d<\/p>\n<p style=\"font-weight: 400;\">OE Solutions will host live demonstrations of the ELSFP at the\u00a0<strong>OFC 2026<\/strong>\u00a0conference at Booth #2359.<\/p>\n<p style=\"font-weight: 400;\">For more information, please visit\u00a0<a href=\"http:\/\/www.oesolutions.com\/\">www.oesolutions.com<\/a>.<\/p>\n<p style=\"font-weight: 400;\"><strong>About OE SOLUTIONS:<\/strong><\/p>\n<p style=\"font-weight: 400;\">OE Solutions is a global technology leader in optical transceivers for both wireless and wireline markets. For more than 20 years, OE Solutions has provided innovative, intelligent and green solutions toempower faster and richer communication, delivering the greatest satisfaction to its customers. OE Solutions is headquartered in Gwangju, South Korea, and has R&amp;D centers in USA, the Netherlands as well as business centers worldwide. For more information, please visit <a href=\"http:\/\/www.oesolutions.com\/\">www.oesolutions.com<\/a>.<\/p>\n<p style=\"font-weight: 400;\"><strong>PR Contact:<\/strong><\/p>\n<p style=\"font-weight: 400;\">OE Solutions<\/p>\n<p style=\"font-weight: 400;\">John Kwak<\/p>\n<p style=\"font-weight: 400;\">T: +1-201-568-1188<\/p>\n<p style=\"font-weight: 400;\">E: john.kwak@oesolutions.com<\/p>\n<p style=\"font-weight: 400;\">\n<p style=\"font-weight: 400;\">\n","protected":false},"excerpt":{"rendered":"<p>Gwangju, South Korea and Ridgefield Park, N.J. \u2013 March 13, 2026 OE Solutions, a global leader in optical innovation, today launched its\u00a0Ultra-High Power (UHP) Cooled ELSFP\u00a0(External Laser Small Form-Factor Pluggable) module. Delivering\u00a023dBm (200mW)\u00a0of optical power per channel, this module provides the high-intensity light source required to drive Co-Packaged Optics (CPO) in next-generation AI environments. By&nbsp; <a href=\"https:\/\/oesolutions.com\/ko\/oe-solutions-announces-23dbm-ultra-high-power-cooled-elsfp-sampling-begins-q3-2026\/\">&hellip; Read more <i class=\"fa fa-arrow-right\"><\/i><\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[3,4],"tags":[],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.5 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>OE Solutions Announces 23dBm Ultra-High Power Cooled ELSFP; Sampling Begins Q3 2026 - OE Solutions - Korean<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/oesolutions.com\/ko\/oe-solutions-announces-23dbm-ultra-high-power-cooled-elsfp-sampling-begins-q3-2026\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"OE Solutions Announces 23dBm Ultra-High Power Cooled ELSFP; Sampling Begins Q3 2026 - OE Solutions - Korean\" \/>\n<meta property=\"og:description\" content=\"Gwangju, South Korea and Ridgefield Park, N.J. \u2013 March 13, 2026 OE Solutions, a global leader in optical innovation, today launched its\u00a0Ultra-High Power (UHP) Cooled ELSFP\u00a0(External Laser Small Form-Factor Pluggable) module. Delivering\u00a023dBm (200mW)\u00a0of optical power per channel, this module provides the high-intensity light source required to drive Co-Packaged Optics (CPO) in next-generation AI environments. 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