Santa Barbara, CA, USA
Who We Are:
OE Solutions is a leading supplier of optoelectronic transceiver solutions for both broadband wireless and wireline markets. Its subsidiary OE Solutions America is developing unique semiconductor-based Photonic Integrated Circuits (PICs) which will drive OE Solutions next generation transceiver products.
The Position:
We are looking for an experienced senior-level Optical Packaging Engineer to expand the engineering team in our Goleta / CA R&D lab. The ideal candidate is highly motivated, self-driven, can work independent as well as in a multi-national team. Versatility and the ability to adapt to varying demands and deadlines is important. We are looking for people with the ability and the desire to learn and expand their knowledge, to work hard with similarly motivated people.
Job Responsibilities:
- Design and improve all aspects of TOSA packaging for high reliability under all required operating conditions
- Design and improve R&D test packages
- Develop and improve assembly process flows for high reliability and low-cost production
- Evaluate and work with contract manufacturers to evaluate and set up production capabilities
- Select parts for BOM list and negotiate performance and pricing with different suppliers
- Assemble chip-on-carriers and full TOSA packages from start to finish using in-house packaging tools
- Operate all required machines like die-bonder, wire-bonder, etc.
- Perform visual inspection and process documentation at every step
- Perform thermal and mechanical stress simulations of packages to guarantee long term reliability for OES products
- Perform optical beam simulations for improving laser diode beam collimation and coupling efficiency to optical fibers
- Perform reliability testing laser diode dies, chip-on-carriers and full packages
Key Qualifications:
- BSc, MSc or PhD or similar education in relevant discipline
- Excellent understanding of optical sub-assembly manufacturing processes and their tolerances
- Excellent understanding of cost, performance, and reliability of various assembly methods like eutectic bonding, thermal and UV epoxy bonding
- Experience in using mechanical 3D modelling software like Solidworks
- Experience in using optical beam simulations tools like Zemax or CodeV
- Experience in using thermal and stress simulation tools like Abaqus or Solidworks
- Hands-on experience in operating assembly machines like wire-bonders, die-bonders, optical alignment
systems, etc.
Compensation: Competitive salary and full range of benefits
Contact:
Holger Klein
OE Solutions America
holger.klein@oesolutions.com
A. 130 Castilian Dr #102, Goleta, CA 93117